ASE Technology Holding Co., Ltd. (ASX)

Provider of semiconductor manufacturing and testing services.

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ASE Technology Holding Co., Ltd. Logo ASE Technology Holding Co., Ltd. is a leading provider of comprehensive semiconductor packaging, testing, and electronic manufacturing services with a global footprint spanning the United States, Taiwan, Asia, Europe, and beyond. Established in 1984 and headquartered in Kaohsiung, Taiwan, the company specializes in delivering advanced packaging solutions that cater to diverse technological needs.

The company's extensive portfolio includes a wide array of packaging services such as flip chip ball grid array (BGA), chip scale package (CSP), and various advanced chip scale packages. ASE also offers innovative packaging solutions like stacked die configurations and 3D chip packages, alongside copper and silver wire bonding capabilities to meet evolving market demands.

In addition to packaging expertise, ASE Technology provides semiconductor testing services that encompass front-end engineering testing, wafer probing, and final testing for logic, mixed-signal, RF modules, and more. The company excels in system-in-package (SiP) and module assembly, ensuring high-quality, reliable products for applications ranging from automotive electronics to consumer electronics.

Beyond its core operations, ASE Technology is involved in real estate development, offering leasing and property management services. It also engages in the production of substrates, provides information software, equipment leasing, investment advisory services, and manages warehousing operations. Committed to technological innovation and operational excellence, ASE Technology continues to play a pivotal role in advancing the semiconductor industry worldwide.

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