Provider of semiconductor packaging and test services for integrated circuits and electronics.
Amkor Technology, Inc. is a global leader in providing outsourced semiconductor packaging and test services across diverse markets spanning the United States, Japan, Europe, the Middle East, Africa, and Asia Pacific. The company specializes in offering comprehensive turnkey solutions encompassing semiconductor wafer bumping, probing, back-grinding, package design, packaging, system-level testing, final testing, and drop shipment services.
Amkor Technology caters to a broad spectrum of industries with its advanced packaging solutions. These include flip chip-scale packages tailored for smartphones, tablets, and other mobile consumer electronics, as well as stacked chip-scale packages used in stacking memory, digital baseband, and application processors for mobile devices. The company also provides flip-chip ball grid array packages essential for networking, storage, computing, and consumer applications.
Additionally, Amkor Technology excels in wafer-level packages such as chip-scale packages (CSP) for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon. Its portfolio extends to wafer-level fan-out packages designed for power management, transceivers, radar, and specialty silicon, offering innovative solutions for integrated circuits (ICs). The company's silicon wafer integrated fan-out technology represents a breakthrough by replacing traditional laminate substrates with thinner structures.
Amkor Technology also provides lead frame packages for low to medium pin count analog and mixed-signal applications, as well as substrate-based wirebond packages that connect a die to a substrate. Moreover, its offerings include micro-electro-mechanical systems (MEMS) packages, featuring miniaturized mechanical and electromechanical devices, and advanced system-in-package modules essential for radio frequency modules, basebands, connectivity solutions, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives.
Founded in 1968 and headquartered in Tempe, Arizona, Amkor Technology continues to innovate and lead in semiconductor packaging and test services, supporting integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers (OEMs), and contract foundries worldwide with cutting-edge solutions tailored to diverse technological needs.